a dab of black ink good chips are selected and packaged to provide an appropriate thermal electrical. and interconnection environment for electronic applications.
IC chips may contain a few components (transistors. diodes. resistors. capacitors etc.) or as many as a billion or more. Since the invention of the monolithic IC in 1959. the number of components on a slate-ọf-the-art iC chip has grown exponentially. We usually refer to the complexity of an IC as its level of integration. Small-scale integration (SSI) refers to up to 100 components per chip, medium-scale integration (MSI) to up to 1000 components per chip. large-scale integration (LSI) tọ up to 100,000 components per chip. very large-scale integration (VLSI) to up to 10T components per chip, and ultralarge-scale integration (ULSI) to larger numbers of components per chip. Section 9.3 describes two uLSI chips: a 32-bit microprocessor cliip, which contains over 42 million componcnts, and a 1-Gb dynamic randoin Access memory (DRAM)chip, which contains over 2 billion components.
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