Call For PapersThe International Conference on Communications and Electronics (ICCE) is becoming a reputable bi-annual international conference series in the scientific community on the areas of Electronics and Communications recently. Following the past successful conferences, the fifth ICCE (ICCE 2014) looks for significant contributions to various topics in communications engineering, networking, microwave engineering, signal processing and electronic engineering. The conference will also include tutorials, workshops, and technology panels given by world-class speakers.TIME AND VENUEICCE 2014 will take place at Pullman Beach Resort in Da Nang, a beautiful coastal city in the middle of Vietnam, from July 30th to August 1st 2014.>>> More detailsPUBLICATIONSFull accepted papers will be published in the ICCE 2014 Conference Proceedings and submitted for inclusion into IEEE Xplore®. The proceedings of ICCE series is indexed by SCOPUS and listed in Conference Proceeding Citation Index (CPCI) of Thomson Reuters.SUBMISSIONPapers must be limited to six pages, including text, references, tables and figures, and should be submitted online. All papers should be prepared according to the IEEE standard template.>>> More detailsSCOPE OF THE CONFERENCEContributed papers are solicited describing original works in electronics, communications engineering and related technologies. Topics and technical areas of interest include but are not limited to the following:I. COMMUNICATIONS NETWORKS AND SYSTEMSNetworking: Future Internet/Future Networks, Crowdsourcing, QoS/QoE and Resource Management, Green Networking, Optical Networks; Wireless, Mobile, Ad-hoc and Sensor Networks, Ubiquitous Networks and Internet of Things, Network Security.Communication Systems: Coding and Information Theory, Wireless, UWB, Ultrasonic Communications, Satellite Communications; Radio-over-Fiber, Free Space and Fiber-Optic Communications; Software Defined Radio, Cognitive Radio; Cooperative Communications, Secured Communication Systems, Multi-antenna Communication Systems.II.SIGNAL PROCESSING & APPLICATIONSImage, Audio, Video Processing, Analysis and Applications.3D Image Processing and Scene Analysis, Multiview Data Integration, 3D Scene or Model Reconstruction from Time-of-Flight Cameras.3D Computer Vision Systems and Applications.Image Based Human-Computer Interaction.Biomedical Signal Processing and Analysis, Computer-Aided Diagnosis.Biomedical Applications in Molecular, Structural, and Function Imaging.PACS and Imaging Informatics.Ambient Intelligence.Signal Processing in GNSS.Signal Filtering, Detection and Estimation.Statistical Signal Processing and Modeling. III. MICROWAVE ENGINEERINGMicrowave Devices/Components Design and Techniques: Passive, Active Devices, MEMS, Integration Techniques, Nano-Scale Devices, Millimeter-Wave and THz Components.Antenna and Propagation: Wideband, Multiband Antennas, Smart Antennas, Digital Beam Forming, MIMO, Antenna Modeling and Measurements, Phased Arrays, Channel Modeling and Propagation.EM Field Theory and Simulation Techniques: EM Field Theory, Numerical Techniques, Metamaterials, FSSs, Electromagnetic Bandgap Structures.RF, Microwave and Millimeterwave Systems and Applications.Other Related Technologies: Nanoscale Integration of Planar, Free-Space, and Mixed Subsystems.IV. ELECTRONICS SYSTEMSCircuits and Design Techniques for Digital, Memory, Analog and Mixed-Signal Systems.Circuits and Design Techniques for High Performance and Low Power.System Design, Synthesis and Optimization; Formal Methods and Verification.Embedded Systems; Reliable and Reconfigurable System.Communication, Consumer and Multimedia System; Medical and Healthcare Systems.Spacecraft Avionics Systems and Applications.V. SPECIAL SESSIONSSpecial Session on Software-Defined Networking >>> More detailsSpecial Session on Underwater Acoustic Communications >>> More detailsSpecial Session on Crowdsourcing >>> More detailsSpecial Session on Information Hiding and Security in Communications: Recent Developments >>> More detailsSpecial Session on Smart Sensors>>> More deta
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