A 10 wt% clay/solvents dispersion (C30B-D) was prepared using magnetic stirring at a rotation
rate of 1000 rpm for 1 h at room temperature and for 1.5 h at 60 ◦C,
followed by sonication at 25 ◦C for 10 min. Epoxy resin was mixed
with a chosen quantity of C30B-D with magnetic stirrer at a room
temperature for 15 min at a rotation rate of 150 rpm and for 5 min at
200 rpm. Then, a stoichiometric quantity of the curing agent (CHSEPOXY 210-x-75:EPICURE 3115-X-75 = 5:1) was added and mixing
was continued for 10 min at rotation rate of 150 rpm. Finally, the
mixture was sonicated for 10 min at 25 ◦C. In order to investigate
the structural (WAXD, SEM), thermal (TGA) and mechanical (DMA)
properties, as well as the water uptake, samples were prepared
in Teflon molds and air-cured for 3 days at room temperature,
followedbyheatinginanovenfor1 hat100 ◦Cand4 hat150 ◦C.Solvent residue was evaporated by drying in a vacuum oven (3 mm Hg)
at 60 ◦C, for 3 days to constant mass.
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