Mould Design Guidevi8.3.3 Milling .

Mould Design Guide
vi
8.3.3 Milling ..................................................................................... 86
8.3.4 Grinding................................................................................... 87
8.3.5 Fabrication ............................................................................... 88
8.3.6 Standard ElectrodischargeMachining (EDM) ............................ 89
8.3.7 Wire Electrodischarge Machining .............................................. 91
8.3.8 Cold Hobbing........................................................................... 92
8.3.9 Beryllium-Copper...................................................................... 93
8.3.10 Electroforming.......................................................................... 93
8.3.11 Cavity Corrosion and Erosion ................................................... 95
8.3.12 Gassing and Burning ................................................................. 95
8.4 Differential Shrinkage ............................................................................. 96
8.5 Maximum Metal Conditions ................................................................... 97
8.6 Example ................................................................................................. 97
9 Two-Plate Mould Tools...................................................................................... 99
9.1 Design Details......................................................................................... 99
9.1.1 Locating or Register Ring.........................................................101
9.1.2 Top Plate.................................................................................101
9.1.3 Split Line .................................................................................102
9.1.4 Cavity Insert ............................................................................102
9.1.5 Front Cavity Plate ....................................................................102
9.1.6 Rear Cavity Plate .....................................................................102
9.1.7 Cavity Support Plate ................................................................103
9.1.8 Ejection System........................................................................103
9.1.9 Ejection Gap ............................................................................104

Kết quả (Việt) 1:

Khuôn mẫu thiết kế hướng dẫnvi8.3.3 Milling ..................................................................................... 868.3.4 Grinding................................................................................... 878.3.5 Fabrication ............................................................................... 888.3.6 tiêu chuẩn ElectrodischargeMachining (EDM)... 898.3.7 Electrodischarge gia công dây điện... 918.3.8 Cold Hobbing........................................................................... 928.3.9 Beryllium-Copper...................................................................... 938.3.10 Electroforming.......................................................................... 938.3.11 ăn mòn khoang và xói mòn... 958.3.12 gassing và đốt cháy... 958.4 vi sai co rút... 968.5 tối đa điều kiện kim loại... 978.6 Example ................................................................................................. 979 Two-Plate Mould Tools...................................................................................... 999.1 Design Details......................................................................................... 999.1.1 định vị hoặc đăng ký vòng... 1019.1.2 Top Plate................................................................................. 1019.1.3 Split Line ................................................................................. 1029.1.4 Cavity Insert ............................................................................ 1029.1.5 tân khoang tấm... 1029.1.6 Rear Cavity Plate ..................................................................... 1029.1.7 khoang hỗ trợ tấm... 1039.1.8 Ejection System........................................................................ 1039.1.9 Ejection Gap ............................................................................ 104

Kết quả (Việt) 2:

Khuôn Hướng dẫn thiết kế
vi
8.3.3 Phay .......................................... ........................................... 86
8.3.4 mài .. .................................................. ............................... 87
8.3.5 Chế tạo .............. .................................................. ............... 88
8.3.6 chuẩn ElectrodischargeMachining (EDM) .......................... .. 89
8.3.7 Dây Electrodischarge Máy ......................................... ..... 91
8.3.8 lạnh hobbing ....................................... .................................... 92
8.3.9 Beryllium Copper-....... .................................................. ............. 93
8.3.10 Electroforming ................................ .......................................... 93
8.3.11 hốc Ăn mòn và xói mòn .................................................. . 95
8.3.12 thoát khí và Burning .......................................... ....................... 95
8.4 Differential co ngót ....................... .................................................. .... 96
8.5 Điều kiện kim loại tối đa ......................................... .......................... 97
8.6 Ví dụ ..................... .................................................. .......................... 97
9 Hai tấm Khuôn mẫu Công cụ ................. .................................................. ................... 99
9.1 Chi tiết Thiết kế ........................... .................................................. ............ 99
9.1.1 Định vị hoặc Đăng ký nhẫn .............................. ........................... 101
9.1.2 trên tấm ................. .................................................. .............. 101
9.1.3 Chia đường .............................. .................................................. 0,102
9.1.4 hốc Insert ........................................... ................................. 102
9.1.5 Mặt trận hốc tấm .......... .................................................. ........ 102
9.1.6 Chuẩn hốc tấm ................................... .................................. 102
9.1.7 hốc Hỗ trợ tấm ......... .................................................. ..... 103
9.1.8 nhả Hệ thống ....................................... ................................. 103
9.1.9 nhả giấy Gap ........... .................................................. ............... 104