The Epikote 828 was preheated to 80oC in a vacuum oven to reducethe viscosity of the resin. A specific amount of nanoclay was added into the Epikote 828 and mechanically stirrer at 400 rpmin a heated oil bath of 80oC for 2 h. The mixture was degassed in a vacuum oven at 80oC to remove the entrapped air, whichthen was blended with the appropriate stoichiometric amounts of NMA hardener and BDMA accelerator for 15 min. Thenanomodified resin was afterwards poured into release-coated silicon moulds and degassed in the vacuum oven beforecuring to remove any air entrapped in the mixture. Finally, the resin system was pre-cured at 80oC for 2 h, cured at 120 oCfor 3 h and post-cured at 150 oC for 4 h with a ramp rate of 1oC/min followed by cooling down to room temperature at1oC/min.
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